Zerode Heatsink Manufacturing (Shenzhen) Co., Ltd_High power liquid water cooling heatsink

IT communication cooling solution

3C products, also known as information home appliances, generally refer to computer, communication and consumer electronic products, with a wide variety of market demand, China has become the world's largest 3C product consumer market, with the improvement of national economic level and income level, the quality of electronic products also put forward higher requirements. Businesses have launched higher configuration, higher performance, better designed products to meet consumers.

Customer SVG heat dissipation design requirements are as follows

PCB source temperature	≤100℃
CPU temperature	≤100℃

（1）

DCDC export	Direction rate: 10W/(m*k) Power: 5W
CPU chipsets	Direction rate: 10W/(m*k) Power: 10W
PCB MST	Direction rate: 15W/(m*k) Power: 5W
CPU PCB	Directive rate: 15W/(m*k) Power: 4W
CPU heatsink	Size: 125956mm, substrate thickness :2mm, fin quantity: 10pcs Thickness: 0.6mm; Conductivity: AL-extru. 180W/(m*K).
CU piece	Size: 41414.7, Conductivity :385 W/(m*k)
Thermal paste	Thickness: 0.3mm, conductivity :3.5W/(m*K)
Welding method	Solder 4258, conductivity :48W/(m*k) 0.2mm

（2）

Grille front	Size :170*27mm, opening rate :0.5
Grille right	Size :35*30 mm, opening rate :0.6
Grille back	Size :30*30 mm, opening rate :0.7
fan	Size :303010 mm

（3）

Board top	Size :140170mm, conductivity :10W/(mk), power :3W
Heat source side	0.8W/pcs
Heat source body front	Left row :0.8W/pcs, right row: 1.2W/pcs, The row marked "2" :1.5W/pcs.
Heatsink	Size :1401704.5mm, substrate thickness: 2mm, fin height :2.5mm, Fin quantity :10pcs, fin thickness :0.6mm, conductivity :180W/(m*K).
Thermal paste	Thickness: 0.3mm, conductivity :3.5W/(m*K).

（4）

Board bottom	Size :140170mm, conductivity :10W/(mk), power :3W.
Source of inverse	power：1.5W/pcs
Heatsink	Size :1401704.5mm, substrate thickness: 2mm, fin height :2.5mm, Fin quantity :10pcs, fin thickness :0.6mm, conductivity :180W/(m*K).
Thermal paste	Thickness: 0.3mm, conductivity :3.5W/(m*K).

Radiator cooling solution Description

(1) Add a 30*10mm axial fan to increase the air flow through the RX module;

(2) Modify the copper fins in front of the fan to increase the air flow of the system.

Schematic diagram of the overall layout simulation model for heat dissipation

Copper fin	Size :30120.3mm, tilt: 1.0, quantity: 30pcs.
Copper fin	Material :C1100, conductivity :385W/(m*K).
Heat pipe	D6 tube thickness: 3mm, pressure tube process, heat pipe type: powder sintering, conductivity :10000W/(m*k)
Add a 30*10mm axial flow fan, and the opening rate of the new fan port area is 0.7.
Septum	Size :160330.5mm, material: stainless steel

CPU module simulation temperature and airflow distribution diagram

Ambient temperature: 40℃; CPU chipset Maximum temperature :64.43 ° C.

CPU module simulation temperature and airflow distribution diagram

CPU fan operating point: Volume flow rate :2.43ft^3/min Pressure :17.47Pa

Simulation temperature distribution diagram on top of RX module

NO.	Maximum temperature	NO.	Maximum temperature	NO.	Maximum temperature
Source 1	59.43	Source 1.7	59.73	Source 3.1	59.59
Source 1.1	59.54	Source 2	60.02	Source 3.2	59.7
Source 1.2	59.66	Source 2.1	60.19	Source 3.3	59.77
Source 1.3	59.73	Source 2.2	60.16	Source 3.4	59.8
Source 1.4	59.76	Source 2.3	59.96	Source 3.5	59.8
Source 1.5	59.77	Source 2.4	59.96	Source 3.6	59.78
Source 1.6	59.76	Source 3	59.48	Source 3.7	59.74